FMIC’s manufacturing facility is located in Shenzhen, China. The land area is about 96,000 square meters. We plan to establish two Fabs(Fab1 and Fab2)by stages. Fab1 refers to two 6” production line, the designed capacity of which is 50,000pcs/month. The first phase of Fab-1A was completed in 2006 and achieved full production of wafer output of 20,000pcs per month in Dec. 2009. The second phase of Fab-1B was transferred a hot line production from Intel; Along with the process tools, FMIC also acquired Intel’s special process technologies for MCU, HV-CMOS, HV-DMOS, BiCMOS, and embedded flash for consumer electronics products. Toshiba Corporation also invested with its core technology in FMIC for long term technical support.

Fab-1A and Fab-1B achieved wafer output of 50,000pcs per month in July, 2011.The whole capacity will expand to 60,000pcs/month in December, 2011. At present, the capacity and capability of FMIC leap into the front ranks of the 6” production line in china.